Thermally conductive materials are designed and developed for the heat transfer requirements of equipment, with excellent performance and reliability. They are suitable for a variety of environments and requirements, and have appropriate countermeasures for various heat dissipation problems that may arise, which provide a powerful help for the highly integrated equipment and ultra-small and ultra-thin product design.

The ideal thermal interface material should have the following characteristics:

     1, high thermal conductivity

     2, high flexibility, to ensure that at the lower installation pressure, the material can fill the gap of the contact surface to the fullest, ensuring that the contact thermal resistance between the thermal interface material and the contact surface is small.

     3, insulation

     4, easy to install and detachable

     5, wide applicability, can be used to fill small gaps, but also fill large gaps.

Type of thermal conductive material:

     1, thermal grease

     The thermal conductive silicone grease is made of organic silicone as a main raw material, and is made of a material having excellent heat resistance and thermal conductivity, and is made of a thermally conductive silicone grease composite for use in heat conduction of power amplifiers, transistors, tubes, CPUs, and the like. Heat dissipation to ensure the stability of electrical performance of electronic instruments and meters.

     2, thermal double-sided adhesive

     The heat-conductive double-sided adhesive is widely used in the bonding between the power device and the heat sink, and can simultaneously realize the functions of heat conduction, insulation and fixation, and can effectively reduce the volume of the device, and is an advantageous choice for reducing the equipment cost.

   
  3, thermal silica film

     The thermal conductive silicone sheet has good thermal conductivity and high level of withstand voltage, meets the current demand for thermal materials in the electronics industry, and is the best alternative to the binary heat dissipation system of silicone grease and mica. This type of product is easy to install and facilitates automated production and product maintenance. It is a highly conductive and practical material.

    
 4, thermal insulation potting glue

     Thermally conductive and insulating potting compound is suitable for potting of electronic components with high heat dissipation requirements. The adhesive has good thermal conductivity after curing, excellent insulation, excellent electrical properties, good adhesion and good surface gloss.

    5, thermal graphite sheet

     The thermal graphite sheet has special technology and advanced technology. The extraordinary thermal conductivity and low resistance are the materials used in special occasions. The thermal conductivity and the flexibility of the material itself are well matched to the heat dissipation of the power device. And installation requirements. High thermal conductivity, thin material, high cost performance, and superior longitudinal thermal conductivity can quickly eliminate hot spots.

     6, thermal phase change interface material

     The thermal phase change material utilizes the characteristics of the substrate to cause a phase change in the working temperature, thereby making the material more conformable to the contact surface, and also obtaining an ultra-low thermal resistance, and more thorough heat transfer, which is a CPU, a module power supply, etc. A reliable choice for critical devices.
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